T1M-05-F-SH-L Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD R/A 5POS 1MM
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 250VAC, 353VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 5
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 85°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.181" (4.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 214.57 грн |
| 50+ | 168.51 грн |
| 100+ | 142.93 грн |
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Технічний опис T1M-05-F-SH-L Samtec Inc.
Description: CONN HEADER SMD R/A 5POS 1MM, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 5, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.181" (4.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP).
Інші пропозиції T1M-05-F-SH-L за ціною від 125.19 грн до 279.11 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||
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T1M-05-F-SH-L | Виробник : Samtec |
Conn Shrouded Header HDR 5 POS 1mm Solder RA Side Entry SMD T/R |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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T1M-05-F-SH-L | Виробник : SAMTEC |
Description: SAMTEC - T1M-05-F-SH-L - Stiftleiste, Wire-to-Board, 1 mm, 1 Reihe(n), 5 Kontakt(e), Oberflächenmontage, abgewinkelt, T1M tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 5Contacts euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: T1M productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 1Rows Rastermaß: 1mm SVHC: No SVHC (14-Jun-2023) |
на замовлення 827 шт: термін постачання 21-31 дні (днів) |
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T1M-05-F-SH-L | Виробник : Samtec |
Headers & Wire Housings 1.00 mm Discrete Wire Terminal Strip |
на замовлення 950 шт: термін постачання 21-30 дні (днів) |
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T1M-05-F-SH-L | Виробник : Samtec Inc. |
Description: CONN HEADER SMD R/A 5POS 1MM Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 5 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.181" (4.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) |
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